Global Semiconductor Capital Equipment Market Report 2019-2023 with Market Position of Key Players - Applied Materials, ASML, Hitachi High-Technologies, LAM Research & Tokyo Electron

Dublin, Dec. 14, 2018 (GLOBE NEWSWIRE) -- The "Global Semiconductor Capital Equipment Market 2019-2023" report has been added to ResearchAndMarkets.com's offering.

The analysts have predicted that the semiconductor capital equipment market will register a CAGR of more than 6% by 2023.

Owing to the rising need for semiconductor memory devices due to the rapidly advancing dynamics of consumer electronics, the semiconductor memory devices market demand is expected to rise throughout the forecast period.

Market Overview

Rising number of fabs

The increasing need for creating ICs for different applications is leading to the rising construction of fabs. Such rising construction of fabs will proliferate the semiconductor production capacity, in turn, leading to the continuous growth of the semiconductor capital equipment market in the forthcoming years.

Shortage of skilled and trained personnel

The lack of knowledge and skills in the fields of engineering and technology owing to the gradual decline in technical education programs across schools is hindering the growth of the semiconductor market, in turn, impacting the semiconductor capital equipment market adversely during the forecast period.

Competitive Landscape

The market is quite fragmented and with the increasing presence of various regional players, the market competition is likely to become quite intense. As more and more vendors focus on increasing the production capacity, the competition will rise in the forthcoming years. The research report offers detailed insights about the market players which will help the clients in making strategic business decisions.

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

• Preface
• Currency conversion rates for US$

PART 03: MARKET LANDSCAPE

• Market ecosystem
• Market characteristics
• Market segmentation analysis

PART 04: MARKET SIZING

• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

PART 06: MARKET SEGMENTATION BY TYPE

• Market segmentation by type
• Comparison by type
• Wafer-level manufacturing equipment - Market size and forecast 2018-2023
• Packaging and assembly equipment - Market size and forecast 2018-2023
• Automated test equipment - Market size and forecast 2018-2023
• Market opportunity by type

PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE

• Geographic segmentation
• Geographic comparison
• APAC - Market size and forecast 2018-2023
• Americas - Market size and forecast 2018-2023
• EMEA - Market size and forecast 2018-2023
• Key leading countries
• Market opportunity

PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES

• Market drivers
• Market challenges

PART 11: MARKET TRENDS

• Advances in wafer size
• Growing demand for 14-nm/16-nm FinFET technology
• Increased need for semiconductor memory devices

PART 12: VENDOR LANDSCAPE

• Overview
• Landscape disruption

PART 13: VENDOR ANALYSIS

• Vendors covered
• Vendor classification
• Market positioning of vendors
• Applied Materials
• ASML
• Hitachi High-Technologies
• LAM RESEARCH
• Tokyo Electron

PART 14: APPENDIX

For more information about this report visit https://www.researchandmarkets.com/research/jhgqt3/global?w=12

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                    Related Topics: Semiconductor